Leadership name
Chief Executive Officer
Leads company strategy, partner relationships, and public technical positioning for Hayagreeva HEx.
About Hayagreeva
Thermal engineering for the AI era
AI chips are using more power and producing more heat. Hayagreeva develops direct-to-chip liquid cooling so data-center operators, OEMs, and integrators can sustain accelerator performance as rack density increases.
Our approach
The aim is not louder marketing — it is to make the technology easier to understand, easier to trust, and easier to contact. We state what has been tested, explain the conditions when possible, and avoid turning technical numbers into unsupported promises.
Hayagreeva HEx is our first AI thermal-management product: a direct-to-chip cold plate validated for more than 5,000 W of continuous heat removal with a rated thermal resistance of 0.005 °C/W, copper-matrix architecture, and 14 patent filings.
Leadership
Readers want to know who is building the product and who can speak about the technology.
Engineering lead
Chief Technology Officer
Oversees copper-matrix thermal design, validation methodology, and engineering contact for pilot programmes.
Operations lead
Head of Manufacturing
Directs production processes, quality systems, and scale-up for package-specific cold-plate programmes.
Stock portraits shown for layout only — replace with approved leadership photos before external publication.
Platform compatibility
Accelerator architectures referenced for compatibility — not as endorsement unless written approval exists.
NVIDIA
AMD
Intel
Press & media
Company description, fact sheet, product images, and leadership bios available on request.
Media inquiries