Copper-matrix technology
Engineered for extreme heat flux
Hayagreeva HEx uses a copper matrix with more than 4,000 m²/m³ of wetted surface area. Thermal capacity, fluid paths, and facility interfaces are engineered as one continuous energy path from die to rejection.
Why direct-to-chip cooling
AI accelerators are using more power and producing more heat. Conventional air cooling cannot keep pace with rack power density at the package level.
Direct-to-chip liquid cooling concentrates capacity at the highest-heat components — where thermal throttling limits sustained compute performance.
Energy path
Hayagreeva HEx sits at the interface where semiconductor waste heat becomes manageable fluid energy. Thermal load moves off the die, through the rack, and out of the building.
Validation & testing
Thermal performance is validated against stated test conditions. Rated metrics are separated from design targets and depend on coolant properties, flow rate, inlet temperature, and package geometry.
At 5,000 W with 0.005 °C/W rated thermal resistance, the measured path implies roughly a 25 °C temperature rise under stated conditions.
Validated under stated conditions
Thermal performance is validated against stated test conditions. Rated metrics are separated from design targets and depend on coolant properties, flow rate, inlet temperature, and package geometry.
| Test methodology | Performance figures stated with units and conditions from public product materials |
|---|---|
| Claims policy | No unsupported superlatives; patent filings referenced as filings unless granted |
| Technical resources | Downloadable fact sheet available on request — contact engineering for NDA materials |
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