Thermal engineer
Package-level thermal modeling, test design, and validation for direct-to-chip cold plates.
Career
Build the thermal layer for AI infrastructure
Hayagreeva is engineering direct-to-chip liquid cooling for the next generation of high-power accelerators. We look for people who want to solve hard heat problems with clear evidence and precise work.
How we work
Engineering-first
We explain what we tested and what we learned — not what we hope will be true.
Technical credibility
Performance claims are tied to test conditions. Honesty about pilot status builds trust with buyers.
Cross-functional teams
Thermal, mechanical, fluid, and manufacturing engineers work together from design through validation.
Open roles
Mechanical design engineer
Cold-plate geometry, mounting interfaces, and package-specific integration for accelerator platforms.
Applications engineer
Support qualified operators and OEM partners evaluating Hayagreeva HEx for pilot programmes.
Roles listed are representative. Contact us if your background fits our mission but no role matches exactly.
Benefits & culture
Technical depth
Work on package-level thermal problems at the frontier of AI rack power density.
Evidence-based culture
Validation and test conditions matter more than marketing claims.
Growth stage
Join early as Hayagreeva HEx moves from pilot programmes toward broader deployment.
Interested in joining?
Send your CV and a short note on the thermal or manufacturing problems you want to work on.
Get in touch